Toshiba (OTCPK: TOSBF), using pixels that are only 1.4 microns small, will be mass producing a 14.6 megapixel CMOS sensor that measures 1/2.3 inches starting in Q3 2010. The sensors…

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Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies, products and services, today introduced the WCN1312(TM) – a single-chip, high-performance 802.11n-compliant wireless local-area networking (WLAN) solution for handsets and mobile devices. This highly integrated device supports data rates of up to 72 Mbps – significantly higher than previous 802.11a, b, and g Wi-Fi solutions, which makes for a better user experience while downloading data, watching streaming video or surfing the Internet.

The WCN1312 solution offers a high level of integration with a 2.4 GHz 802.11n baseband processor, media-access controller, RF transceiver, transmit power amplifier, low-noise amplifier, transmit switch, power coupler and radio-frequency (RF) bandpass filter all in a small 7×7 mm package. This simplified design eliminates the need for many external RF components, minimizing the component count, which in turn, results in a smaller system footprint.

The new WCN1312 chip uses low-power 65nm CMOS technology and advanced power-management techniques to minimize sleep, standby and active power consumption. It is optimized for performance with Qualcomm’s complete Mobile Station Modem(TM) (MSM(TM)) solutions and supports a variety of mobile operating systems, including Qualcomm’s Brew Mobile Platform(R), Android and Windows Mobile. The WCN1312 chip is the industry’s first mobile handset device to support both 1×1 and 1×2 dual-receive configurations to increase range and data throughput performance when needed. The WCN1312 solution also implements advanced coexistence architecture and algorithms to optimize performance when paired with Qualcomm’s Bluetooth(R) solutions. This is slated for sampling in Q2 2009.

Source: MobileBurn