Seoul, Korea - May 30, 2007: Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced that it has developed a four gigabyte (GB) MCP (multi-chip package) for mobile phones that for the first time forgoes the need for an external memory card slot and also eliminates having to develop interface software for all types of NAND memory.

Samsung’s new moviMCP is a multi-chip package carrying an embedded (moviNAND????) memory solution, which provides a simple-to-design memory package that satisfies the high-speed data transmission needs of mobile phones, while fully supporting the communication features within the handset.

????We’ve now perfected a memory chip that allows handset manufacturers to significantly reduce development time while deploying an extremely robust design that will result in higher performance for smaller phones, with higher storage capacities,???? said Jim Elliott, director, flash marketing director, Samsung Semiconductor, Inc.